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  • Data centers are ready for
    “hot-water cooling” 

What does the launch of the NVIDIA Rubin platform mean for data center power demand? Innovation is enabling data centers to redirect power to more compute with hot-water cooling, advanced cold plates and intelligent coolant distribution units (CDUs).  Further, when cooling and power architectures are co-designed, data centers can achieve greater levels of efficiency and reliability from chip to grid.

At CES2026, NVIDIA CEO Jensen Huang emphasized Rubin’s chip energy parity and a shift in data center cooling: next-generation AI systems can operate with inlet coolant temperatures up to 45°C (113°F)—a concept known as hot-water cooling. This approach dramatically reduces reliance on energy-intensive chillers, cutting cooling energy costs and boosting AI factory efficiency.

Current data centers use a significant amount of power for chiller systems that provide refrigerated coolant to the servers. Hot-water cooling will shift data center power to CDUs and enable more chips to operate on the same grid connection. Reallocating power to more AI computing can allow up to 33% more AI factory output per grid connection.

This is a classic case of the Jevons Paradox: efficiency enabling sustainable growth. 

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Dr. Peter de Bock, vice president, Data Center Energy and Cooling Technology, Eaton

Why hot-water cooling matters for data centers 

  • Traditional cooling requires massive chiller plants to refrigerate air and coolants, consuming significant power.
  • Liquid cooling with advanced CDUs and cold-plates enables much more efficient heat transfer from GPUs, which allows for coolant temperature to be warmer, up to hot-water at 45°C (113°F), such that it does not need chilling anymore.
  • When cooling and power architectures are co-designed, the control logic in intelligent CDUs can allow for communication and coordination with the power systems for even greater levels of efficiency and reliability.
  • Hot-water coolant for NVIDIA systems exits at even higher temperatures and is easily cooled by simple dry cooling systems most of the time (no evaporative water cooling needed). 

 

Next generation CDUs and cold plates for high-power chips

  • Intelligent CDUs that coordinate cooling systems co-architected with the power delivery architecture.
  • Precision-engineered liquid cooling cold plates with finer features deliver efficient, reliable heat removal for GPUs and central processor units (CPUs) – allowing for hot water use.
  • Advanced manufacturing processes will produce high quality cold plates and intelligent CDUs  at large volumes.

 

Impact – increased AI factory computing power without additional energy demand

  • Intelligent CDUs can coordinate coolant and power delivery architecture, delivering greater efficiency and reliability.
  • Advanced cold plate designs and cooling loops can capture up to 80–90% of heat with hot water and allowing the data center to use dry coolers with minimal energy.
  • This shift moves the chiller energy budget to expanded electrical architecture and AI GPUs, creating customer value.

 

Data center operators can save 20–40% in energy costs, reinvesting in more electrical infrastructure and GPUs for higher AI throughput—potentially 33% more compute, token per watt without expanding grid capacity

 

Why it matters - these technologies allow data centers to do more with less power 

Intelligent CDUs and hot water cooling will bring dramatic efficiency improvements that’ll enable data centers to move power and cost out of facility cooling, and into the electrical architecture, power distribution and additional GPUs to support denser AI factories. While it may not lead to less power consumption, it’ll mean that AI factories can do more with the power they have.   

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